PCB Assembly Capability
| Category |
Description |
Capability |
| File Formats |
Gerber files(preferred), AutoCAD, DWG |
274-X,274-D, DXF, … |
| BOM (Bill of Materials) |
Excel(preferred), PDF |
| Pick and Place file (XYRS) |
X & Y coordinates |
| Board type |
Board types for assembly |
Rigid, Flexible, Rigid-Flex |
| Board Size |
Minimum and Maximum |
Smallest size: 2.0” x 2.0”, 50mm x 50mm
Largest size: 19.7” x 19.7”, 500mm x 500mm |
| Solder paste printing |
Max stencil size |
1560mm x 450mm |
| Pick and Place |
Min. SMT part package |
0201 |
| Min. IC pitch |
0.3mm |
| Min.chip size |
01 005 |
| QFP lead pitch |
0.38mm to 2.54mm |
| BGA capability |
BGA ball pitch |
0.5mm to 3.00 mm |
| BGA ball size |
0.4mm to 1.0mm |
| Reballing and Rework (De-population and Re-population) |
| Reflow |
Optimized Reflow Profiling and multi-zone temperature control |
| Wave flow |
temperature control and tooling |
| Assembly and builds |
Press Fit Connectors |
Yes |
| Mechanical Assembly and Box Builds |
Yes |
| Cable & Harness Assembly |
Yes |
| Rework |
De-population and Re-population |
Yes |
| Fine Pitch |
Yes |
| Cuts & Jumps |
Yes |
| Minor PCB Repair |
Yes |
| Wash |
De-ionized Wash |
Yes |
| Testing |
Visual Inspection |
Yes |
| AOI (Automated Optical Inspection) |
Yes |
| ICT (In Circuit Test) |
Yes |
| X-Ray |
Yes |
| Functional Test |
Yes |
| |
Firmware loading |
Yes |
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