PCB Assembly Capability

Category Description Capability
File Formats Gerber files(preferred), AutoCAD, DWG 274-X,274-D, DXF, …
BOM (Bill of Materials) Excel(preferred), PDF
Pick and Place file (XYRS) X & Y coordinates
Board type  Board types for assembly Rigid, Flexible, Rigid-Flex
Board Size Minimum and Maximum  Smallest size: 2.0” x 2.0”, 50mm x 50mm
Largest size: 19.7” x 19.7”, 500mm x 500mm
Solder paste printing Max stencil size 1560mm x 450mm
Pick and Place Min. SMT part package 0201
Min. IC pitch 0.3mm
Min.chip size 01 005
QFP lead pitch  0.38mm to 2.54mm
BGA capability BGA ball pitch 0.5mm to 3.00 mm
BGA ball size 0.4mm to 1.0mm
Reballing and Rework (De-population and Re-population)
Reflow Optimized Reflow Profiling and multi-zone temperature control
Wave flow temperature control and tooling 
Assembly and builds Press Fit Connectors Yes
Mechanical Assembly and Box Builds Yes
Cable & Harness Assembly Yes
Rework De-population and Re-population Yes
Fine Pitch Yes
Cuts & Jumps Yes
Minor PCB Repair Yes
Wash  De-ionized Wash Yes
Testing Visual Inspection Yes
AOI (Automated Optical Inspection) Yes
ICT (In Circuit Test) Yes
X-Ray Yes
Functional Test Yes
  Firmware loading Yes